Low Contraction Rate XPS Foam Board for Underfloor Heating

Stable XPS thermal insulation foam board for underfloor-heating substrate applications

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Product description

Product Overview

Low Contraction Rate XPS Foam Board for Underfloor Heating uses a closed-cell extruded polystyrene rigid foam structure to support thermal insulation, low moisture absorption and practical compressive stability. The lightweight board format simplifies transport, cutting and installation for project and wholesale supply.

Key Features

  • Closed-cell XPS construction for dependable building performance.
  • Lightweight rigid boards are easy to carry, cut and position.
  • Suitable for underfloor-heating systems, floors, thermal barriers and building energy-efficiency assemblies.
  • Dimensions, thickness, density and edge profiles can be customized.
  • OEM labels and export packaging are available for bulk orders.

Applications

Recommended for underfloor-heating systems, floors, thermal barriers and building energy-efficiency assemblies. The complete assembly and installation method should follow the project design and local building requirements.

Customization and Quality Control

Production and inspection can cover dimensions, surface condition, edge quality, density, packaging and agreed project-specific requirements.

Request a Quote

Send the application, dimensions, thickness, quantity, packaging preference and destination to Baozhinuan for specification review and quotation.

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